Reaction-Layer of Silicon-Nitride Ceramics to Metal Joints Using Ni-Base Solder
نویسندگان
چکیده
منابع مشابه
effect of gap distance on tensile strength of preceramic base metal solder joints
background and aims. in order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. however, these prostheses always fail at their solder joints. the purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. materials and methods. based on ada/iso 9693 specifications...
متن کاملOrthopedic applications of silicon nitride ceramics.
Silicon nitride (Si(3)N(4)) is a ceramic material developed for industrial applications that demand high strength and fracture resistance under extreme operating conditions. Recently, Si(3)N(4) has been used as an orthopedic biomaterial, to promote bone fusion in spinal surgery and to develop bearings that can improve the wear and longevity of prosthetic hip and knee joints. Si(3)N(4) has been ...
متن کاملEffect of Gap Distance on Tensile Strength of Preceramic Base Metal Solder Joints
BACKGROUND AND AIMS In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. MATERIALS AND METHODS Based on ADA/ISO 9693 specifications...
متن کاملEffects of solder volume on formation and redeposition of Au- containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
متن کاملEffects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints
SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Ni/Au-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...
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ژورنال
عنوان ژورنال: Journal of the Ceramic Society of Japan
سال: 1992
ISSN: 0914-5400,1882-1022
DOI: 10.2109/jcersj.100.924